Diallyl-Phthalate (DAP) has long been the material of choice for critical, high-performance military and commercial electrical components where long-term reliability is demanded.
DAP molding compounds lies in the chemistry of the resin system, which enables the parts molded from these compounds to retain their superior insulating properties, even when subjected to extreme environmental conditions of high heat and high humidity over long time periods. Additionally, DAP compounds will resist dimensional change in high-heat soldering environments where competitive materials may warp.
Key Properties:
Physical
Virtually no post-mold shrinkage
Mechanical
High impact resistance
Highly resistant to sudden, extreme jolts and severe stresses
Thermal
FS-10-VO-200: 200°C UL? temperature index
Isophthalate (DAIP) materials are recommended for very high temperature applications
Chemical
Highly resistant to solvents, acids, alkalies, fuels, hydraulic fluids, plating chemicals and sterilizing solutions
Fungus Resistance
Inert to fungus growth